Facultatem ad PCB Assemb / Pcba
Min. chip: 0201 (0603), 0402 (1005)
Min. spatio: BGA 0.4mm Pitch, QFP/QFP 0.3mm Pitch
Max. magnitudine: 533610mm
Support type: Manual welding, DIP plug-in, SMT, Cable faciens, BGA pila, Rework, Connector crimping
Support product: Communications, Industrialis imperium, Chip temptationis, Automotive electronics, Medicamenta,etc..
Support modus: Processing, Pasce processus, Bonded processui, Processus non religata
√ Japan imported equipment √ Two decades of experience √ Focus on prototyping √ Real-time progress tracking
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