סיום רך קבל קרמיקה קרמיקה | MLCC |CCAB
Jinpei Multilayer Ceramic Chip Capacitors supplied in bulk or tape & reel package are ideally suitable for thick-film hybrid circuits and automatic surface mounting on any printed circuit boards.
CCAB series use a special material between nickel-barrier and ceramic body. It provides excellent performance to against bending stress occurred during process and provide more security for PCB process.
The nickel-barrier terminations are consisted of a nickel barrier layer over the silver metallization and then finished by electroplated solder layer to ensure the terminations have good solderability. The nickel barrier layer in terminations prevents the dissolution of termination when extended immersion in molten solder at elevated solder temperature.
מָבוֹא
Jinpei Multilayer Ceramic Chip Capacitors supplied in bulk or tape & reel package are ideally suitable for thick-film hybrid circuits and automatic surface mounting on any printed circuit boards.
CCAB series use a special material between nickel-barrier and ceramic body. It provides excellent performance to against bending stress occurred during process and provide more security for PCB process.
The nickel-barrier terminations are consisted of a nickel barrier layer over the silver metallization and then finished by electroplated solder layer to ensure the terminations have good solderability. The nickel barrier layer in terminations prevents the dissolution of termination when extended immersion in molten solder at elevated solder temperature.
תכונות
a.High performance to withstanding 3~5mm of substrate bending test guarantee.
b.A wide selection of sizes is available.
c.High capacitance in given case size.
d.Capacitor with lead-free termination (pure Tin).
e.Reduction in PCB bend failure.
f.High reliability and stability.
g.RoHS & Jinpei compliant.
APPLICATIONS
a.For general digital circuit.
b.For power supply bypass capacitors.
c.For consumer electronics.
d.For telecommunication.
e.DC to DC converter.
דוגמה מספר חלק
| CCAB | 1210 | X | 225 | ק | 2א | ה | G | G |
| JINPEI
Series No. |
גוֹדֶל | Dielectric | קיבול | סוֹבלָנוּת | מדורג
מֶתַח |
אריזה | עוֹבִי | Control
קוד |
| לוּחַ 1 | Table2 | לוּחַ 3 | לוּחַ 4 | לוּחַ 5 | לוּחַ 6 | לוּחַ 7 | לוּחַ 8 | לוּחַ 9 |
| לוּחַ 1 | Series No. |
| קוד | תֵאוּר |
| FP | Anti-Bend General Purpose Product |
| לוּחַ 2 | General Purpose | |||||
| קוד | תֵאוּר | קוד | תֵאוּר | קוד | תֵאוּר | |
| 15 | 0402 (1005) | 32 | 1210 (3225) | 52 | 2211 (5728) | |
| 18 | 0603 (1608) | 42 | 1808 (4520) | 55 | 2220 (5750) | |
| 21 | 0805 (2012) | 43 | 1812 (4532) | 56 | 2225 (5763) | |
| 31 | 1206 (3216) | 46 | 1825 (4563) | |||
| לוּחַ 3 | Dielectric Material Characteristics | |||
| קוד | תֵאוּר | קוד | תֵאוּר | |
| N | מל"ג | ב | X7R | |
| X | X5R | י | Y5V | |
| לוּחַ 4 | Capacitance Rule Code | |||
| קוד | תֵאוּר | קוד | תֵאוּר | |
| R47 | 0.47pF | 102 | 102=10×102=1000pF | |
| 0R5 | 0.5pF | 104 | 104=10×104=100nF | |
| 100 | 100=10×100=10pF | 106 | 106=10×106=10µF | |
| לוּחַ 5 | סוֹבלָנוּת | |||||
| קוד | תֵאוּר | קוד | תֵאוּר | קוד | תֵאוּר | |
| א | ±0.05 pF | אֲנִי | -10% ~ 0% | ש | ±0.03 pF | |
| ב | ±0.10 pF | י | ±5 % | ז | -20% ~ +80% | |
| ג | ±0.25 pF | ק | ±10 % | X | +10% ~+20% | |
| ד | ±0.50 pF | ל | 0% ~ +10% | |||
| ו | ±1 % | מ | ±20 % | |||
| G | ±2 % | N | -5% ~ +10% | |||
| ח | ±3 % | פ | ±0.02 pF | |||
| לוּחַ 6 | מתח מדורג | |||||
| קוד | תֵאוּר | קוד | תֵאוּר | קוד | תֵאוּר | |
| 0י | 6.3Vdc | 2ד | 200Vdc | 3ר | 1500Vdc | |
| 1א | 10Vdc | 2ה | 250Vdc | 3ד | 2000Vdc | |
| 1ג | 16Vdc | 2G | 400Vdc | 3U | 3000Vdc | |
| 1ה | 25Vdc | 2ח | 500Vdc | 3G | 4000Vdc | |
| 1ח | 50Vdc | 2י | 630Vdc | 3ח | 5000Vdc | |
| 2א | 100Vdc | 3א | 1000Vdc | 3אֲנִי | 6000Vdc | |
| לוּחַ 7 | Packaging Type | |||
| קוד | תֵאוּר | קוד | תֵאוּר | |
| ב | תִפזוֹרֶת | ט | Tray package | |
| ה | Tape and 7” Reel, Embossed Tape | פ | Tape and 7” Reel, Paper Tape | |
| ק | Tape and 10” Reel, Embossed Tape | ד | Tape and 10” Reel, Paper Tape | |
| ל | Tape and 13” Reel, Embossed Tape | G | Tape and 13” Reel, Paper Tape | |
| לוּחַ 8 | Thickness Description | |||||
| קוד | תֵאוּר | קוד | תֵאוּר | קוד | תֵאוּר | |
| א | 0.60 ± 0.10 מ"מ | אֲנִי | 1.25 ± 0.20 מ"מ | ש | 0.50 +0.02/-0.05 מ"מ | |
| ב | 0.8 + 0.15/-0.10מ"מ | י | 1.15 ± 0.15 מ"מ | ר | 3.10 ± 0.30 מ"מ | |
| ג | 1.25 ± 0.10 מ"מ | ק | 0.50 ± 0.20 מ"מ | ס | 0.80 ± 0.07 מ"מ | |
| ד |
1.40 ± 0.15 מ"מ |
ל |
0.30 ± 0.03 מ"מ |
ט |
0.85 ± 0.10 מ"מ |
|
| ה |
1.60 ± 0.20 מ"מ |
מ |
0.95 ± 0.10 מ"מ |
U |
0.50 ± 0.10 מ"מ |
|
| ו | 2.00 ± 0.20 מ"מ | N | 0.50 ± 0.05 מ"מ | V | 0.20 ± 0.02 מ"מ | |
| G | 2.50 ± 0.30 מ"מ | O | 3.50 ± 0.20 מ"מ | X | 0.80 ± 0.10 מ"מ | |
| ח | 2.80 ± 0.30 מ"מ | פ | 1.60 +0.3/-0.10 מ"מ | ז | 0.25 ± 0.03 מ"מ | |
| לוּחַ 9 | Special Control Code | |||
| קוד | תֵאוּר | קוד | תֵאוּר | |
| G | תואם RoHS | ח | אמינות גבוהה | |
| O | Gold plating (Size≥0603) | ש | Surface Coating (Size 1206~2225) | |
מָבוֹא
א. High performance to withstanding 3~5mm of
substrate bending test guarantee.
ב. A wide selection of sizes is available.
ג. High capacitance in given case size.
ד. Capacitor with lead-free termination (pure
Tin).
ה. Reduction in PCB bend failure.
ו. High reliability and stability.
ז. RoHS & Jinpei compliant.









