Mooglikheid Foar PCB Assemb / PCBA
● Min. chip: 0201 (0603), 0402 (1005)
● Min. spacing: BGA 0.4mm Pitch, QFP/QFP 0,3 mm Pitch
● Max. grutte: 533× 610 mm
● Stipe type: Hânlieding welding, DIP plug-in, SMT, Kabel meitsjen, BGA bal, Rework, Connector krimp
● Stypje produkt: Kommunikaasje, Yndustriële kontrôle, Chip testen, Automotive elektroanika, Medyske apparatuer,ensfh.
● Stipe modus: Ferwurking, Feed ferwurking, Bonded ferwurking, Ferwurkjen fan net-bonded
√ Japan imported equipment √ Two decades of experience √ Focus on prototyping √ Real-time progress tracking
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