Conduttive Polimero Chip Tantalum Capacità SMD ▏CBAC

DIMENSIONI – MILLIMETERS

Esempio di numero di parte

Soldering Process

Jinpei tantalum capacitors are compatible with wave (single or dual), convection, E, or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress.
Suntan’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J CBAC standard for moisture sensitivity testing. The devices can safely withstand a maximum of three reflow passes at these conditions.

Hand soldering should be performed with care due to the difficulty in process control. If performed, care should be taken to avoid contact of the soldering iron to the molded case. The iron should be used to heat the solder pad, applying solder between the pad and the termination, until reflow occurs. Once reflow occurs, the iron should be removed immediately. “Wiping” the edges of a chip and heating the top surface is not recommended.

During typical reflow operations, a slight darkening of the gold- colored epoxy may be observed. This slight darkening is normal and not harmful to the product. Marking permanency is not affected by this change.

Nota: Specifications are subject to change without notice. Per maggiori dettagli e aggiornamenti, si prega di visitare il nostro sito web.

Caratteristiche
⚫ Epoxy molded encapsulation, Chip, Facile per l'integrazione, Polarized
⚫ Extremely low ESR , Volumetricamente efficiente , Stabile in elettrico & storage performances, Lunga durata,Alta affidabilità
⚫ Typical applications include DC/DC converters, PC portatili, elettronica portatile, telecomunicazioni
(telefono cellulare e stazione base ), visualizza,SSD,HDDand USB
⚫ Operative Standard: QJ/PWV517-2013.
⚫ Conformità RoHS