Faucet panas segera

Program keran panas segera dibangunkan oleh mikrokomputer tunggal-cip NY8A050D JIUQI. Model pakej adalah 8-pin SOP, yang dibangunkan dan direka melalui program cip kawalan utama. Produk ini menggunakan SCM untuk mengawal komponen pemanas untuk memanaskan aliran air melalui paip air. Mudah digunakan: turn on the faucet

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Pembersih Pergigian Ultrasonik

Pembersih gigi ultrasonik dibangunkan oleh NY8A050D, yang dibungkus dengan SOP 8-pin. Ia dibangunkan dan direka oleh program cip kawalan utama. Produk ini menggunakan teknologi nadi kawalan mikrokomputer tunggal cip, Menggunakan motor kelajuan tetap AC untuk menghantar ultrasonik untuk menghancurkan kalkulus pergigian. Satu mesin suis operasi utama, one key to adjust

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Kotak Moksibusi Pintar Tanpa Wayar

Wireless intelligent moxibustion box program development by Jiuqi SINGLE chip NY8A062D model package model is 16 pin SOP, through the main control chip program development and design; The electronic product development and design is a very suitable for moisture removal of portable electronic equipment, through the single-chip control OF THE PTC heater catalysis artemisinia muggrass,…

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Reka bentuk PCB Oximeter

The oximeter is used to detect blood oxygen. Monitoring blood oxygen is a non-invasive operation, which can effectively monitor the situation of blood oxygen in the body and play a key role in predicting the change of the disease. The main measurement indexes of oximeter are pulse rate, blood oxygen saturation and perfusion index (PI).…

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Penyelesaian Sentuhan Inframerah

Infrared touch PCBA solution, multi-touch, drive free, applied to touch all – in – one machine, teaching all – dalam – one machine, advertising machine and so on. Full name of infrared touch frame: Infrared touch frame technology, touch the outer box installed in the integrated circuit, infrared emission and receiving of LED electronic component…

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Mikroelektronik hibrid

Hybrid microelectronic Jinpei is using existing conventional screen printing techniques to apply structures of less than 50 garisan μm|jarak jurang ke substrat seramik. Kami boleh menawarkan anda faedah berikut: ► Production of Hybrid circuits with extremely fine structures at low costs ► Avoiding local routing congestion ► Reducing the number of interconnected required layers Dust

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PCB Assembaga | PCBA

Keupayaan Untuk Perhimpunan PCB / PCBA ● Min. cip: 0201 (0603), 0402 (1005) ● Min. jarak: Padang 0.4mm BGA, QFP/QFP 0.3mm Pitch ● Max. saiz: 533×610mm ● Support type: Kimpalan manual, pemalam DIP, SMT, Pembuatan kabel, bola BGA, Kerja semula, Connector crimping ● Support product: Komunikasi, Kawalan perindustrian, Ujian cip, Elektronik automotif, Peralatan perubatan,dll. ● Support

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