Vadoša polimēra čipsi tantalum kondensatori SMD ▏CBAC

IZMĒRI – MILLIMETERS

DAĻAS NUMURA ​​PIEMĒRS

Soldering Process

Jinpei tantalum capacitors are compatible with wave (single or dual), convection, UN, or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress.
Suntan’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J CBAC standard for moisture sensitivity testing. The devices can safely withstand a maximum of three reflow passes at these conditions.

Hand soldering should be performed with care due to the difficulty in process control. If performed, care should be taken to avoid contact of the soldering iron to the molded case. The iron should be used to heat the solder pad, applying solder between the pad and the termination, until reflow occurs. Once reflow occurs, the iron should be removed immediately. “Wiping” the edges of a chip and heating the top surface is not recommended.

During typical reflow operations, a slight darkening of the gold- colored epoxy may be observed. This slight darkening is normal and not harmful to the product. Marking permanency is not affected by this change.

Piezīme: Specifikācijas var tikt mainītas bez iepriekšēja brīdinājuma. Lai iegūtu sīkāku informāciju un atjauninātu, lūdzu, apmeklējiet mūsu vietni.

Funkcijas
⚫ Epoxy molded encapsulation, Mikroshēma, Viegli integrējams, Polarizēts
⚫ Extremely low ESR , Tilpuma ziņā efektīva , Stabils elektriskajā & storage performances, Ilgs kalpošanas laiks,Augsta uzticamība
⚫ Typical applications include DC/DC converters, piezīmjdatori, pārnēsājama elektronika, telekomunikācijas
(mobilais tālrunis un bāzes stacija ), displeji,SSD,HDDand USB
⚫ Operative Standard: QJ/PWV517-2013.
⚫ RoHS compliant