Myk avslutning på flerlags keramisk chip -kondensator | MLCC |CCAB
Jinpei Multilayer Ceramic Chip Capacitors supplied in bulk or tape & spolepakken er ideell for tykkfilm hybridkretser og automatisk overflatemontering på alle trykte kretskort.
CCAB-serien bruker et spesielt materiale mellom nikkelbarriere og keramisk kropp. It provides excellent performance to against bending stress occurred during process and provide more security for PCB process.
The nickel-barrier terminations are consisted of a nickel barrier layer over the silver metallization and then finished by electroplated solder layer to ensure the terminations have good solderability. The nickel barrier layer in terminations prevents the dissolution of termination when extended immersion in molten solder at elevated solder temperature.
INTRODUKSJON
Jinpei Multilayer Ceramic Chip Capacitors supplied in bulk or tape & spolepakken er ideell for tykkfilm hybridkretser og automatisk overflatemontering på alle trykte kretskort.
CCAB-serien bruker et spesielt materiale mellom nikkelbarriere og keramisk kropp. It provides excellent performance to against bending stress occurred during process and provide more security for PCB process.
The nickel-barrier terminations are consisted of a nickel barrier layer over the silver metallization and then finished by electroplated solder layer to ensure the terminations have good solderability. The nickel barrier layer in terminations prevents the dissolution of termination when extended immersion in molten solder at elevated solder temperature.
Funksjoner
a.High performance to withstanding 3~5mm of substrate bending test guarantee.
b.A wide selection of sizes is available.
c.High capacitance in given case size.
d.Capacitor with lead-free termination (pure Tin).
e.Reduction in PCB bend failure.
f.High reliability and stability.
g.RoHS & Jinpei compliant.
APPLICATIONS
a.For general digital circuit.
b.For power supply bypass capacitors.
c.For consumer electronics.
d.For telecommunication.
e.DC to DC converter.
Delnummereksempel
| CCAB | 1210 | X | 225 | K | 2EN | E | G | G |
| JINPEI
Series No. |
Størrelse | Dielektrisk | Kapasitans | Toleranse | Vurdert
Spenning |
Emballasje | Tykkelse | Control
Kode |
| Bord 1 | Table2 | Bord 3 | Bord 4 | Bord 5 | Bord 6 | Bord 7 | Bord 8 | Bord 9 |
| Bord 1 | Series No. |
| Kode | Beskrivelse |
| FP | Anti-Bend General Purpose Product |
| Bord 2 | General Purpose | |||||
| Kode | Beskrivelse | Kode | Beskrivelse | Kode | Beskrivelse | |
| 15 | 0402 (1005) | 32 | 1210 (3225) | 52 | 2211 (5728) | |
| 18 | 0603 (1608) | 42 | 1808 (4520) | 55 | 2220 (5750) | |
| 21 | 0805 (2012) | 43 | 1812 (4532) | 56 | 2225 (5763) | |
| 31 | 1206 (3216) | 46 | 1825 (4563) | |||
| Bord 3 | Dielectric Material Characteristics | |||
| Kode | Beskrivelse | Kode | Beskrivelse | |
| N | NPO | B | X7R | |
| X | X5R | Y | Y5V | |
| Bord 4 | Capacitance Rule Code | |||
| Kode | Beskrivelse | Kode | Beskrivelse | |
| R47 | 0.47pf | 102 | 102=10×102=1000pF | |
| 0R5 | 0.5pf | 104 | 104=10×104=100nF | |
| 100 | 100=10×100=10pF | 106 | 106=10×106=10µF | |
| Bord 5 | Toleranse | |||||
| Kode | Beskrivelse | Kode | Beskrivelse | Kode | Beskrivelse | |
| EN | ±0.05 pF | jeg | -10% ~ 0% | Q | ±0.03 pF | |
| B | ±0.10 pF | J | ±5 % | Z | -20% ~ +80% | |
| C | ±0.25 pF | K | ±10 % | X | +10% ~+20 % | |
| D | ±0.50 pF | L | 0% ~ +10% | |||
| F | ±1 % | M | ±20 % | |||
| G | ±2 % | N | -5% ~ +10% | |||
| H | ±3 % | P | ±0.02 pF | |||
| Bord 6 | Nominell spenning | |||||
| Kode | Beskrivelse | Kode | Beskrivelse | Kode | Beskrivelse | |
| 0J | 6.3Vdc | 2D | 200Vdc | 3R | 1500Vdc | |
| 1EN | 10Vdc | 2E | 250Vdc | 3D | 2000Vdc | |
| 1C | 16Vdc | 2G | 400Vdc | 3U | 3000Vdc | |
| 1E | 25Vdc | 2H | 500Vdc | 3G | 4000Vdc | |
| 1H | 50Vdc | 2J | 630Vdc | 3H | 5000Vdc | |
| 2EN | 100Vdc | 3EN | 1000Vdc | 3jeg | 6000Vdc | |
| Bord 7 | Packaging Type | |||
| Kode | Beskrivelse | Kode | Beskrivelse | |
| B | Bulk | T | Tray package | |
| E | Tape and 7” Reel, Embossed Tape | P | Tape and 7” Reel, Paper Tape | |
| K | Tape and 10” Reel, Embossed Tape | D | Tape and 10” Reel, Paper Tape | |
| L | Tape and 13” Reel, Embossed Tape | G | Tape and 13” Reel, Paper Tape | |
| Bord 8 | Thickness Description | |||||
| Kode | Beskrivelse | Kode | Beskrivelse | Kode | Beskrivelse | |
| EN | 0.60 ± 0.10 mm | jeg | 1.25 ± 0.20 mm | Q | 0.50 +0.02/-0.05 mm | |
| B | 0.8 + 0.15/-0.10mm | J | 1.15 ± 0.15 mm | R | 3.10 ± 0.30 mm | |
| C | 1.25 ± 0.10 mm | K | 0.50 ± 0.20 mm | S | 0.80 ± 0.07 mm | |
| D |
1.40 ± 0.15 mm |
L |
0.30 ± 0.03 mm |
T |
0.85 ± 0.10 mm |
|
| E |
1.60 ± 0.20 mm |
M |
0.95 ± 0.10 mm |
U |
0.50 ± 0.10 mm |
|
| F | 2.00 ± 0.20 mm | N | 0.50 ± 0.05 mm | V | 0.20 ± 0.02 mm | |
| G | 2.50 ± 0.30 mm | O | 3.50 ± 0.20 mm | X | 0.80 ± 0.10 mm | |
| H | 2.80 ± 0.30 mm | P | 1.60 +0.3/-0.10 mm | Z | 0.25 ± 0.03 mm | |
| Bord 9 | Special Control Code | |||
| Kode | Beskrivelse | Kode | Beskrivelse | |
| G | RoHS-kompatibel | H | Høy pålitelighet | |
| O | Gold plating (Size≥0603) | Q | Surface Coating (Size 1206~2225) | |
INTRODUKSJON
en. High performance to withstanding 3~5mm of
substrate bending test guarantee.
b. A wide selection of sizes is available.
c. High capacitance in given case size.
d. Capacitor with lead-free termination (pure
Tin).
e. Reduction in PCB bend failure.
f. High reliability and stability.
g. RoHS & Jinpei compliant.









